Dear Axe,
Here is the informations about Huawei SDDs, Huawei SSDs use Micron 16 nm MLC and Toshiba 15 nm MLC flash chips. Later SSD products are planned to use 3D-TLC and other chips.
It is good practice not to present the difference between eMLC and cMLC because chips are only a less important factor for SSD reliability, which depends more on the architecture design and firmware algorithm optimization. Huawei SSDs increase redundancy ratio and use error correction algorithms such as LDPC to ensure overall reliability for SSDs during operation.
Does this help you?