Hello,
Today I would like to share with you when the side panel of the OSN1500 subrack is blocked causing poor heat dissipation.
Description
An OSN1500 device reports a TEMP_ALARM alarm, and the network manager checks that the temperature on the CXL board is 80 degrees. The ambient temperature of the computer room is about 10 to 15 degrees, and there is no high-power heat source near the OSN1500 equipment. The OSN1500 is installed in a 19-inch cabinet. There is a space of about 2 cm between the side of the OSN1500 chassis and the side door of the cabinet. There are no obstacles such as cables. Cleaning the dust filter, replacing the fan, and replacing the CXL board cannot completely solve the problem.
Warning message
TEMP_ALARM
Process
After cleaning the flocculent dust on the left panel mesh of the OSN1500, the heat dissipation air volume increased significantly, and the device temperature dropped. After 24 hours, the detection temperature of the CXL board stabilized at about 30 degrees, and the problem was solved.
Cause
1. The operating environment is normal, and the abnormal heat generation of the single board has been removed after replacement. The cause of the failure is the poor heat dissipation of the OSN1500.
2. Open the handle of the empty slot, and it is found that there is basically no wind blowing, and it is analyzed that the heat dissipation air duct is abnormal.
3. Analyze the heat dissipation channels of the OSN1500. The cold air reaches the fan through the mesh on the left side of the OSN1500 chassis and the dust-proof net. After passing through the veneer, the hot air is discharged through the mesh on the right side of the chassis.
4. The dust-proof net is a steel wire-type dust-proof net, which is dust-free.
5. The fan is operating normally.
6. Check the mesh on the left side panel of the OSN1500 chassis. It is found that a large amount of flocculent dust is attached to the outside of the chassis, and the mesh is basically blocked, which prevents cold air from entering the device and forms effective heat dissipation.
Conclusions
1. The heat dissipation channel of the OSN1500 equipment includes the side panel of the chassis. When the operating environment is dusty, the mesh of the side panel is easy to be blocked and cause poor heat dissipation. In general maintenance and troubleshooting, only pay attention to cleaning the dust screen and neglect the cleaning of the side panel, which affects the heat dissipation capacity of the device.
2. The left side panel of the machine frame is the air inlet, and the outside is easy to adhere to dust and not easy to find.
3. When installing OSN1500, pay attention to avoid blocking the side panel and affect heat dissipation, and some space must be reserved.
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