Board with a larger cross-connect capacity than the AMXS board on the Metro 5000

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Metro 5000 is an old SDH device. Currently, the cross-connect board with the maximum capacity is EMXS. It provides a 20 Gbit/s capacity for higher-order cross-connections and a 5 Gbit/s capacity for lower-order cross-connections.

Other related questions:
METRO equipment 3000 cross capacity
SS61EXCS cross board is cross OptiX 2500 + system clock board, veneer can achieve 96 x96 VC - 4 levels of high-order cross, 12 or 288 x 6048 x 6048 VC - 288 VC - 3 level low cross or equivalent of VC x96vc 96-4-4, VC - 3, VC - 12 reasonable mixed configuration.From 12 line/branch clock reference source and two external clock reference source option as a source of phase lock, possess the function of the sync processing status word, at the same time for the system to provide the 155.52 MHz and 77.76 MHz, 38.88 MHz and 2.048 MHz clock signals and 2 m frame, 8 k frame signal.SS61EXCS veneer in addition to the low order cross capacity is 6048 or 288 x 288 x 6048 VC to 12 VC - 3, other function and SS62XCS, SS63XCS, SS64XCS veneer is fully compatible with (SS62XCS/SS63XCS/SS64XCS low-order intersection capacity of 2016 or 96 x 96 x 2016 VC to 12 VC - 3)

Ports mounted on a VB of the EGS2 board of the Metro 5000
A maximum of 30 ports can be mounted on a VB.

Cross-connect capability of the TN16UXCM board
The TN16UXCM board supports cross-connect grooming of ODUk (k = 0, 1, 2, 2e, 3, 4, or flex) signals and VC-4/VC-12/VC-3 signals and packet switching of Ethernet services. The maximum grooming capability is 640 Gbit/s (the capability is increased to 1.28T in V100R007C02).

Cause for the failure to create ODU1 cross-connections on TN52TOM boards on OSN 6800 (without cross-connect boards)
The TN52TOM board does not support distributed ODU1 cross-connections.

Whether the FE08 board for the Metro 5000 can be interconnected with the EFS board for OSN equipment
The FE08 board uses the HDLC protocol for encapsulation. The EGS and EFS boards use the GFP protocol for encapsulation. Therefore, the FE08 board cannot interconnect with the EGS and EFS boards.

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