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Capacity Term

Created: Feb 2, 2022 03:01:04Latest reply: Feb 2, 2022 05:55:40 161 3 0 0 0
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I read in the features of some equipment that it has TDM 200Gbps high order capacity and 20 Gbps low order capacity. What is meant by high order and low order capacity?

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liqiang185
Admin Created Feb 2, 2022 04:03:10

Dear friend!

This is a key measure of the cross-connect capability of the two levels of equipment.

The cross-connect board of the equipment has two types of cross-connect chips: higher-order cross-connect chip and lower-order cross-connect chip.

The higher order cross-connect chip processes services at the VC-4 level (155 Mbit/s or higher).

The lower order cross-connect chip processes the service granularity of VC-4 or less, for example, VC-12 (2 Mbit/s) and VC-3 (34 Mbit/s). Different cross-connect boards of the same type have different cross-connect capabilities.

Such as the TDM Cross-Connect Capacity of OSN 7500:

OSN

The position of the device on the network determines the minimum switching granularity and switching capacity of the cross-connect chip. For example, the core backbone node does not need to add or drop small-granularity tasks. The core requirement is large-capacity and large-granularity cross-connect grooming. The edge node serves as the service termination point for small-capacity users. A large number of lower order cross-connections are required to directly add and drop services.

SDH

As shown in the preceding figure, a large number of lower order cross-connections are required at the access layer and a large number of higher order cross-connections are required at the backbone layer.


Thank you!

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Dear friend!

This is a key measure of the cross-connect capability of the two levels of equipment.

The cross-connect board of the equipment has two types of cross-connect chips: higher-order cross-connect chip and lower-order cross-connect chip.

The higher order cross-connect chip processes services at the VC-4 level (155 Mbit/s or higher).

The lower order cross-connect chip processes the service granularity of VC-4 or less, for example, VC-12 (2 Mbit/s) and VC-3 (34 Mbit/s). Different cross-connect boards of the same type have different cross-connect capabilities.

Such as the TDM Cross-Connect Capacity of OSN 7500:

OSN

The position of the device on the network determines the minimum switching granularity and switching capacity of the cross-connect chip. For example, the core backbone node does not need to add or drop small-granularity tasks. The core requirement is large-capacity and large-granularity cross-connect grooming. The edge node serves as the service termination point for small-capacity users. A large number of lower order cross-connections are required to directly add and drop services.

SDH

As shown in the preceding figure, a large number of lower order cross-connections are required at the access layer and a large number of higher order cross-connections are required at the backbone layer.


Thank you!

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